Intel Develops New Solution for Cooling Laptops


Intel Develops New Solution for Cooling Laptops

One of the common problems of users is that the laptops become hot during gaming or prolonged use. While manufacturers have found various solutions to this problem, Intel has developed this design, which combines the solutions already found.

As consumers, we expect a laptop to be powerful, lightweight and slim, as well as to cool the processor inside. In recent years, manufacturers have been able to respond to these demands relatively by reducing the size of laptops, but they have to say that they are having some difficulty in cooling.

While these requirements can be met using powerful cooling methods, they make the devices heavier and more noisy than desired. So mobile and laptop manufacturers are also looking for more innovative solutions.

Last year HEXUS; Asus ROG Phone II, the Aorus 17 laptop and the Asus ProArt StudioBook One are powered by steam chamber cooling technology. Another highlight was the Cryorig C7 G, a low-profile coolant with graphene coating. Apparently Intel is also working on a new laptop cooling solution. The new solution, which is part of Project Athena, will be strengthened with steam chamber design and graphene or graphics.

Intel will announce its new laptop thermal module at CES 2020, which will be held on January 7, according to Taiwan’s DigiTimes. According to industry sources, the new module will combine steam chamber and graphite plate technology. This will improve heat loss by 30%.

In addition, it was emphasized that steam tanks have a more flexible structure compared to heat pipes due to their size, shape and positioning options. DigiTimes said that there will be significant changes in the design of the thermal module. Conventional thermal modules are positioned underneath the keyboard and eject it backwards.

The new cooling solution will use this space, but the graphics plate cooling surface is thought to extend to the folding hinges. So you will be using a wider area to lose heat behind the screen.

The new thermal module is expected to simplify fanless notebook designs, refine existing designs, and take place in new Windows 10X laptops. The company is expected to introduce this new cooling solution at CES 2020.

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